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Conductive film etching solution Product List

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Etchant for amorphous transparent conductive films 'ITO-07N'

Etchant for amorphous transparent conductive films 'ITO-07N'

Residue-free ITO etchant compatible with various underlying films such as SiO₂ and SiNx!

“ITO-07N” is a transparent conductive thin-film etchant that enables high-precision patterning of amorphous ITO, IZO, and other materials in FPD manufacturing processes. 【Features】 ■ Optimal for patterning amorphous ITO, IZO, etc. ■ Minimal side etching, allowing for high-precision patterning ■ Low foaming properties and excellent defoaming performance *Please feel free to contact us.

  • Surface treatment contract service
  • Conductive film etching solution

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Ag・Ag alloy・Ag-based laminated film etching solution

Ag・Ag alloy・Ag-based laminated film etching solution

This etching solution is ideal for etching single-layer films of silver alloys such as Ag single films, APC (Ag-Pd-Cu alloy) films, or laminated films of Ag/transparent conductive films.

The features of this product are as follows: - The etching rate is stable. - There is minimal side etching, allowing for the formation of fine patterns. - The in-plane uniformity of etching speed and etching shape is excellent. Keywords: wet etching, silver, APC

  • Chemicals
  • Conductive film etching solution

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Etchant for polycrystalline transparent conductive films "ITO Series"

Etchant for polycrystalline transparent conductive films "ITO Series"

Low-resistance polycrystalline ITO film etchant – Cu damage suppression depending on model number

"Mixed Acid ITO-02" is an etching solution that enables high-precision patterning of low-resistance poly-ITO electrodes in the FPD manufacturing process. Additionally, "ITO-301" is an etching solution that suppresses Cu damage and allows for the patterned formation of low-resistance poly-ITO electrodes. 【Features】 ■ Usable for etching low-resistance poly-ITO films ■ Capable of etching poly-ITO films and amorphous ITO films at low temperatures and in a short time ■ No damage to glass substrates ■ Cu damage can be suppressed depending on the model number ■ No dilution or formulation is required; it can be used as is

  • Surface treatment contract service
  • Conductive film etching solution

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